OmniVision's OX01F10 is a 1.3MP SoC, providing automotive designers with the industry's best imaging performance across a wide range of challenging lighting conditions, along with the most compact form factor and lowest power consumption. In a single, 1/4" optical format package, the OX01F10 integrates a 3.0 micron image sensor and an advanced image signal processor (ISP) with OmniVision's PureCel®Plus technology for low noise, solving the automotive rear view camera (RVC) and surround view system (SVS) challenges of achieving a small form factor with excellent low-light performance, ultra-low power and reduced cost while improving reliability by using only one printed circuit board (PCB).
This SoC employs dual conversion gain (DCG) technology to achieve a high dynamic range of 120 dB with only two captures, as opposed to three required by the competition, which minimizes motion artifacts while reducing power consumption and boosting low-light performance.
The OX01F10 features less than 300 mW typical power consumption, which is 30% lower than competitors and significantly reduces the temperature. It is the only imaging device today that does not require a metal heat sink, allowing for the use of plastic camera module bodies to reduce costs. With its compact package size, it also enables smaller cameras that can fit in much tighter spaces. In addition, by integrating both the image sensor and ISP into a single chip, designers can save on both cost and space by eliminating the second PCB in typical two-chip implementations.
This SoC provides 1.3MP resolution and a 1340 x 1020 array size at 30 fps, offering ample resolution for calibration. It also enables output flexibility with both 2-lane MIPI and 10-bit DVP interfaces, and is AEC-Q100 Grade 2 certified.