
CameraCubeChip®
OMNIVISION’s CameraCubeChip® integrates image sensors, processor and lenses in a miniature wafer-level camera module
Technology Benefits
Fully integrated components enable ultra-thin, compact devices with advanced imaging capability.


Technology Features
CameraCubeChip® incorporates advanced image-sensor technology into a wafer-level chip-scale package.
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CMOS Image SensorsThe CameraCubeChip® leverages both OMNIVISION’s frontside–illuminated and backside-illuminated CMOS image-sensor technology.
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Wafer-Level OpticsCameraCubeChip® applies semiconductor stacking methodology to fabricate wafer-level optical elements as wafer structure layers.
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Chip-Scale PackagingOMNIVISION’s wafer-level chip-scale packaging expertise provides a simplified supply chain with standard surface mount handling.
Applications
The CameraCubeChip® delivers miniature-camera solutions to the medical, AR/VR and mobile markets.
Product Solutions
OMNIVISION places its customers at the leading edge of imaging technology with its commitment to innovative, forward-thinking solutions.