OMNIVISION’s CameraCubeChip® integrates image sensors, processor and lenses in a miniature wafer-level camera module
Fully integrated components enable ultra-thin, compact devices with advanced imaging capability.
CameraCubeChip® incorporates advanced image-sensor technology into a wafer-level chip-scale package.
CMOS Image SensorsThe CameraCubeChip® leverages both OMNIVISION’s frontside–illuminated and backside-illuminated CMOS image-sensor technology.
Wafer-Level OpticsCameraCubeChip® applies semiconductor stacking methodology to fabricate wafer-level optical elements as wafer structure layers.
Chip-Scale PackagingOMNIVISION’s wafer-level chip-scale packaging expertise provides a simplified supply chain with standard surface mount handling.
The CameraCubeChip® delivers miniature-camera solutions to the medical, AR/VR and mobile markets.
OMNIVISION places its customers at the leading edge of imaging technology with its commitment to innovative, forward-thinking solutions.