OMNIVISION’s OmniBSI™-2 technology extends OmniBSI™ to enhance the signal level in image sensors
OmniBSI™-2 image sensors reduce power consumption and enable more advanced image quality than OmniBSI™.
OmniBSI™-2 features advanced process node design rules and 300mm wafer process to enhance camera performance and capabilities.
65nm Design Rules65nm design rules enable compact pixel circuitry for optimal pixel layout to maximize performance for enhanced image quality.
300mm Wafer Process300mm wafer process improves the stability of production and increases die per wafer for high-volume production applications.
Backside Illumination (BSI)Backside illumination flips pixels and circuitry to collect the light from the backside of the image sensor.
OMNIVISION’s OmniBSI™-2 targets mobile, security, medical, automotive and notebook/PC applications.
OMNIVISION places its customers at the leading edge of imaging technology with its commitment to innovative, forward-thinking solutions.
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