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OmniBSI™ technology features backside illumination for advanced image quality using 0.11-micron process technology.
BSI Backside Illumination (BSI)
Backside-illumination technology flips pixels and circuitry to collect the light from the backside of the image sensor.
Advanced Image Quality
Flipping the wafer reduces the stack height from sensor surface to micro-lens, which realizes higher sensitivity and creates more tolerance in the incident light angle to reach the pixels.
Cost & Performance Advantage
OmniBSI™ is built on product-proven 0.11-micron process technology to provide significant cost and performance advantages.
OmniBSI™ is a revolutionary platform that enables improved sensitivity, color reproduction and image quality.
Best-in-Class Light Absorption
OmniBSI™ represents a leap in low-light performance and signal-to-noise ratio. It enables smaller pixels and smaller die size at a reasonable cost, without sacrificing performance. OmniVision was first to the mobile, surveillance and automotive markets with BSI in volume production.
Enables Thinner Camera Modules
In comparison with frontside-illumination (FSI) sensors, the innovative architecture of OmniBSI™ enables reduced pixel crosstalk, high quantum efficiency, improved low-light sensitivity and ultra-low stack height to meet today’s requirements for ultra-thin mobile handsets.
Wide Chief Ray Angle
A wide chief ray angle (CRA) enables thinner modules with large-aperture lenses for better low-light performance, image quality, true-to-life color reproduction and improved camera performance. It also can be applied to larger pixel designs.
OmniVision’s OmniBSI™ technology is in mobile devices, PC/notebook, automotive, medical and security applications.