OMNIVISION’s new OX03D4C is a 3 megapixel (MP) resolution system-on-chip (SoC) for automotive surround-view systems (SVS), rearview systems (RVS) and e-mirrors. The new SoC provides a seamless path for automotive OEMs to upgrade from 1MP to 3MP while retaining high performance, low power and the smallest 2.1 µm pixel size in a 1/4-inch optical format. The OX03D4C has a fully integrated image signal processor (ISP), is capable of 140 dB high dynamic range (HDR), and includes the next-generation tone-mapping algorithm along with the leading LED flicker mitigation (LFM) performance in the industry.

OMNIVISION’s OX03D4C includes both the pixel array and ISP within a single package; it is optimized to deliver ideal performance over the complete automotive temperature range. It features 105 dB motion-free HDR with a total range of 140 dB, and provides HDR and LFM simultaneously. It includes the next-generation tone-mapping algorithm for high contrast images, supports a number of CFA patterns, and can output both YUV and RAW process streams at the same time. The OX03D4C provides four on-screen display overlay layers for driver guidelines, as well as distortion correction to straighten any curved edges from lenses with a wide viewing angle. The OX03D4C consumes less than 500 mW power, enabling the use of a plastic case for lighter weight and lower cost.

All of these features are built into the smallest possible camera module available for automotive viewing applications. The a-CSP™ package size allows smaller cameras that can fit in much tighter spaces. The image sensor is built on OMNIVISION’s PureCel®Plus‑S stacked die technology.

The OX03D4C SoC complies with ASIL B advanced safety standards.

OMNIVISION Launches Industry’s First 3MP Resolution SoC for Automotive Cameras with Lowest Power and Smallest Size