New 3.45-micron BSI Global Shutter CMOS Image Sensor for Machine Vision Applications

The new OG02C global shutter (GS) CMOS image sensor features a 3.45‑micron (µm) back-side illuminated (BSI) pixel for high sensitivity, industry-leading shutter efficiency and excellent low-light performance for applications including factory automation (FA), robotics, logistics, and industrial barcode scanners. The advanced performance in a smaller pixel enables it to replace larger 4.8 µm pixel front-side illuminated (FSI) sensors traditionally used in machine vision products.

The OG02C10 (color) and OG021B (monochrome) are 2‑megapixel BSI GS sensors that feature OMNIVISION’s industry-leading technology including Nyxel® near-infrared (NIR) and PureCel®Plus‑S. The OG02C comes in a 1/2.53‑inch optical format (OF) and supports 300 frames per second (fps) with 106 dB shutter efficiency. 20Ke- full-well capacity (FWC) enables higher high dynamic range (HDR) with low noise level, resulting in clearer pictures. On‑chip dual conversion gain (DCG™) HDR extends dynamic range, reproducing motion artifact-free and low-noise images in challenging lighting conditions.

The GS sensor fits the standard C‑mount and S‑mount lens and supports both LVDS and MIPI interfaces.

October 3, 2024: OMNIVISION Expands Machine Vision BSI Global Shutter Sensor Portfolio with Three New 3.45‑micron Pixel Products