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OMNIVISION Launches First Sensor With 1.1-Micron Pixel
Aug 03, 2011

LATEST OMNIBSI-2™ PIXEL ENABLES ¼-INCH, 8-MEGAPIXEL MOBILE CAMERA SOLUTION FOR ULTRA SLIM SMARTPHONES

SANTA CLARA, Calif., — August 3, 2011 — OmniVision Technologies, Inc. (NASDAQ: OVTI), a leading developer of advanced digital imaging solutions, today introduced the 8-megapixel OV8850, the first CameraChip™ sensor built on a 1.1-micron OmniBSI-2 pixel architecture. The ¼-inch OV8850 leads the CMOS sensor pixel design race in the smartphone market by enabling autofocus modules that are 20 percent slimmer than any 8-megapixel module in commercial use today. Besides a small footprint, the 1.1-micron OmniBSI-2 pixel offers significant improvements in power efficiency and image quality comparable to the previous generation 1.4-micron OmniBSI™ pixel, making it an attractive solution for next-generation smartphones and tablets.

“With our new OmniBSI-2 architecture, we have further miniaturized our pixels while delivering a 20 percent improvement in peak quantum efficiency in all color channels, a 35 percent improvement in lowlight sensitivity and a 45 percent increase in full-well capacity in an extremely compact and power efficient package,” said Per Rosdahl, senior product manager at OmniVision. “This 1.1-micron OmniBSI2 pixel enables the next generation of miniaturization in mobile cameras, and is key to the high-resolution smartphone camera roadmap.”

Besides its advanced pixel design, the OV8850 also features advanced imaging functions, such as an onchip temperature sensor, two phase lock loops, context switching, and alternate row exposure for high dynamic range (HDR) video and still image capture. An integrated scaler allows the camera to maintain full field of view in 1080p/30 high-definition (HD) video and preview modes and provides additional adjustable resolution for electronic image stabilization (EIS). The sensor’s 2 x 2 binning functionality provides enhanced 720p/60 HD video recording with EIS, an absolute must in today’s advanced mobile devices.

The OV8850 fits in an 8.5 x 8.5mm autofocus camera module with a build height of 4.7 mm. Sampling will begin in August, with mass production expected in the first calendar quarter of 2012.

 

Safe-Harbor Language
Certain statements in this press release, including statements regarding the expected benefits, performance, capabilities, and potential market appeal, as well as anticipated timing of mass production, of the OV8850 are forward-looking statements that are subject to risks and uncertainties. These risks and uncertainties, which could cause the forward-looking statements and OmniVision’s results to differ materially, include, without limitation: potential errors, design flaws or other problems with OV8850, customer acceptance, demand, and other risks detailed from time to time in OmniVision’s Securities and Exchange Commission filings and reports, including, but not limited to, OmniVision’s annual report filed on Form 10-K and quarterly reports filed on Form 10-Q. OmniVision expressly disclaims any obligation to update information contained in any forward looking statement.

About OMNIVISION

OMNIVISION is a global fabless semiconductor organization that develops advanced digital imaging, analog, and touch & display solutions for multiple applications and industries, including mobile phones; security and surveillance; automotive; computing; medical; and emerging applications. Its award-winning innovative technologies enable a smoother human/machine interface in many of today’s commercial devices. Find out more at www.ovt.com.

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