BARCELONA, Spain — February 14, 2006 — Today at the 3GSM World Congress in Barcelona, OmniVision Technologies, Inc. (NASDAQ: OVTI), a world leading supplier of CMOS image sensors, introduced the OV3630DZL stacked die CameraChip solution. With a module size of 9x9x7 mm, the OV3630DZL allows handset customers to upgrade their camera phones from 2 megapixels (OV2630DZL) to 3 megapixels without mechanical design changes. This ‘drop-in’ replacement method will significantly reduce time-to-market, which is critical in today’s highly competitive mobile phone market.
The OV3630DZL is a stacked die camera module design with a 1/3.2-inch optical format and a module size of 9x9x7mm, designed specifically for slim handset designs that require very low power consumption. The module solution features the OV3630, a 3 megapixel CMOS image sensor stacked on top of the advanced OV620 camera bridge processor. The camera bridge processor produces YUV output in various fully processed and encoded data formats, compatible with all common compression standards.
The OV3630 sensor operates at 15 frames per second at full resolution, enabling the use of an electronic shutter instead of the traditional mechanical shutter. This reduces the mechanical envelope needed, allowing faster adoption of 3 megapixel camera phones into the mainstream market. Early adopters of OmniVision’s OV3630DZL can gain a competitive edge in their quest for thinner and sleeker phones.
The OV3630DZL camera offers stunning resolution, light sensitivity, superior dynamic range and power efficiency in a small, feature-rich design. This is largely due to the integrated OmniQSP™ image processing block, which provides high-grade picture processing and has features that are traditionally only found in digital still cameras. The OV3630DZL operates on just 2.8 Volts and features many advanced functions such as image effects, edge enhancement, pixel correction, lens shading and other corrective technologies. The proprietary new sensor technology utilizes advanced algorithms to cancel fixed pattern noise, eliminate smearing and drastically reduce blooming.
The OV3630DZL stacked die module was developed in close cooperation with OmniVision’s module partners, and samples are currently available.
Certain statements in this press release, including statements regarding the Company’s industry position, the performance, achievements and capabilities of OmniPixel2 and the OV3630DZL CMOS image sensor, are forward-looking statements that are subject to risks and uncertainties. These risks and uncertainties, which could cause the forward-looking statements and OmniVision’s results to differ materially, include, without limitation: potential errors, design flaws or other problems with OmniPixel2 or the OV3630DZL CMOS image sensor; the rapid changes in technical requirements for camera phone products; competitive risks; as well as other risks detailed from time to time in OmniVision’s Securities and Exchange Commission filings and reports, including, but not limited to, OmniVision’s most recent annual report filed on Form 10-K and most recently filed report on 10-Q. OmniVision expressly disclaims any obligation to update information contained in any forward-looking statement whether as a result of new information, future events or otherwise.