Combination of OmniBSI architecture with Fujitsu Microelectronics’ Milbeaut processor results in stunning 8 megapixel images for mobile phones
BARCELONA — Feb. 16, 2009 — At the annual Mobile World Congress (MWC) event today, OmniVision Technologies, Inc. (NASDAQ: OVTI), a leading developer of advanced digital imaging solutions, demonstrated its latest 8 megapixel solution based on its award-winning OmniBSI™ architecture. The demonstration platform combines the advanced capabilities of the OV8810 device with the Fujitsu Microelectronics mobile Milbeaut™ M-5MO advanced image signal processor (ISP), to deliver best-in-class image quality and highest quantum efficiency. Designed to improve time-to-market and reduce development costs for mobile phone manufacturers, the platform features 1.4-micron pixel with superior low-light performance, enhanced processing, and distortion compensation.
“Demand for improved image quality in smart phones is growing rapidly, resulting in a shift to higher pixel resolutions,” said Keith Horn, chief operating officer at Fujitsu Microelectronics America. “The combination of OmniVision’s industry-leading OmniBSI architecture with our advanced Milbeaut image processing chip has resulted in the industry’s highest quality 8-megapixel mobile camera solution.”
About the Fujitsu Milbeaut M-5MO
The Fujitsu mobile Milbeaut M-5MO advanced ISP takes advantage of its enhanced processing capabilities to manage pre- and post-processed image data from image sensors. Its new Affine transformation function compensates for image distortion at a pixel level, caused by optical anomalies. The ISP also supports image sensors with MIPI interfaces for high-speed data transfer.
About OmniBSI Technology
OmniVision’s backside illumination (BSI) architecture represents a radical, new approach to traditional CMOS image sensor technology, essentially inverting the sensor to collect light from the backside, which offers the most direct path for light to strike the pixel. The result is a greatly improved fill factor, greater quantum efficiency and significantly reduced cross-talk, which means both greater sensitivity and better color reproduction.
Developed with support from long-time foundry and process technology partner, Taiwan Semiconductor Manufacturing Corporation, the OmniBSI architecture involves turning the sensor upside down so that it collects light through what was previously the backside of the sensor, the silicon substrate. This approach differs from conventional front-side illumination (FSI) image sensors, where the amount of light reaching the photo-sensitive area is limited, in part, by the multiple metal and dielectric layers required to enable the sensor to convert photons into electrons.
Certain statements in this press release, including statements regarding the expected benefits, performance and capabilities of OmniBSI technology are forward-looking statements that are subject to risks and uncertainties. These risks and uncertainties, which could cause the forward-looking statements and OmniVision’s results to differ materially, include, without limitation: potential errors, design flaws or other problems with OmniBSI technology, customer acceptance, demand, and other risks detailed from time to time in OmniVision’s Securities and Exchange Commission filings and reports, including, but not limited to, OmniVision’s annual report filed on Form 10-K and quarterly reports filed on Form 10-Q. OmniVision expressly disclaims any obligation to update information contained in any forward-looking statement