SANTA CLARA, Calif. — Feb. 20, 2019 — OMNIVISION Technologies, Inc., a leading developer of advanced digital imaging solutions, today announced the OV32A, its first 0.8 micron pixel image sensor with 32 megapixel (MP) resolution, built on OMNIVISION’s PureCel®Plus stacked die technology. This new sensor offers leading-edge performance for high-end smartphones.
“The demand for high-performance smartphone cameras is very strong, with consumers clamoring for ever-higher resolution in high-end mobile phones—including selfie cameras,” said Arun Jayaseelan, senior marketing manager at OMNIVISION. “At the same time, circuitry space within smartphones is at a premium. With the OV32A’s submicron 0.8µ pixel size, it can provide leading-edge 32MP resolution with a 1/2.8 inch optical format. This compact form factor, combined with many advanced features such as on-chip re-mosaic and near-pixel binning, make the OV32A ideal for high-end smartphones.”
OMNIVISION’s PureCel®Plus technology uses finer nodes to enable OMNIVISION’s smallest-ever pixel pitch in the OV32A. This sensor also uses a 4-cell color filter array, and features on-chip re-mosaic, which can provide full-resolution, 32MP Bayer output in normal lighting conditions. In low-light conditions, the OV32A can use near-pixel binning to output an 8MP image with 4 times the sensitivity.
The OV32A outputs high-resolution images in a variety of formats, including 32MP at 15 frames per second (fps), 8MP with 4-cell binning at 60 fps, 4K2K video at 60 fps, 1080p video at 120 fps and 720p video at 240 fps. Pad locations on the top and bottom of the image sensor reduce module size in the x-direction, which is ideal for front-facing cameras in thin-bezel, infinity-display smartphones.