SUNNYVALE, CA — May 29, 2001 — OMNIVISION Technologies, Inc. (Nasdaq: OVTI), a leader in designing, developing and marketing advanced, highly integrated CMOS image sensors used in electronic cameras and other optical imaging devices, today announced its OmniStar Cam, a low-power, highly integrated miniature camera module targeted at 2 Gigahertz(G), 2.5G and 3G mobile phones and other portable digital devices such as personal digital assistants (PDAs). The new camera module, based on OMNIVISION’s CIF (352×288) resolution, highly integrated CMOS image sensor, is small in size and has low power consumption. The newest offering from OMNIVISION underscores the company’s commitment to produce cost-effective imaging devices for the high-volume consumer electronics market.
“OMNIVISION recognizes the importance of developing imaging products that meet the specific requirements of the high-volume mobile phone and PDA market,” said Bob Stroh, vice president of strategic marketing and business development for OMNIVISION. “Our experience designing and developing a wide range of imaging solutions has enabled us to meet the small form factor and very low power demands of this market. With the OmniStar Cam we have been able to develop a highly integrated and cost-effective solution that we believe will strengthen our position as a leader in producing imaging devices for the OEM market.”
More On The OmniStar Cam
The OmniStar Cam is developed around OMNIVISION’s OV6645 CMOS image sensor that operates on 3 volts(V) and has a CIF resolution. The 24-lead, LCC-packaged camera chip is enclosed along with a lens in a small 12mm x 12mm x 7mm plastic housing. The entire assembly is mounted on a small flexible circuit that provides a 20-pin, 0.5mm pitch interconnect enabling the use of industry-standard flex circuit connectors. The flex circuit’s length and shape can be tailored to meet specific requirements of high volume users.
The housing and flex circuit are completely shielded from local sources of electro-magnetic interference (EMI) that are commonly encountered in mobile phone handsets. The shielding also protects the cell phones’ sensitive receiver circuits from interference that could be generated by the digital camera.
Module output is a fully processed and the encoded digital video data stream conforms to the ITU-BT.656 digital video standard. As no other image or video processing chips are required to produce the necessary digital video output, the design is simplified and quicker time-to-market can be realized. The streamlined design that utilizes all pre-tested packaged parts enables lower overall costs by achieving high manufacturing yields for the assembled modules.
The image/video processing and encoding is done on-chip in the analog domain, reducing the power required for operation. Current consumption, while producing video at 30 FPS, is listed at less than 15milliamps at 3 volts yielding 45 milliwatts. Standby current is rated at less than ten micro amps yielding only 30 microwatts.
Other on-chip circuits include automatic white balance, automatic gain control and automatic exposure control. If needed, the module offers built-in sub-sampling down to QCIF (176×144) resolution. This frees the targeted product from needing any additional components for image or video generation. Manufacturers of next-generation base-band, accessory processor and compression chips can take the fully encoded data stream input directly for use by their application with no need for extra data processing or color interpolation.
While the standard digital color output is in the YUV 422 color space, YCrCb and raw RGB data is available by simple chip programming over the two-wire serial control interface. The same serial control interface allows the designer extensive control over chip operation, including output configuration, and control of image parameters such as contrast, saturation and hue.
Pricing And Availability
Samples of the production version of the OmniStar Cam are now available to qualified OEMs. Volume production is scheduled for the fourth quarter of 2001. Also available is a USB-based evaluation platform that interfaces directly to the new module using a flex circuit connector.
OEMs may contact OMNIVISION sales by email at sales@ovt.com or by phone at 408-733-3030 for volume pricing.
About OMNIVISION
OMNIVISION Technologies, Inc. designs, develops and markets high-performance, high-quality and cost-efficient camera chips. The company’s highly integrated image sensors are used in a variety of electronic cameras and optical imaging products for both still picture and live video applications. OMNIVISION’s image sensors provide all the functionality of a complete camera, and only a lens need be added. OMNIVISION is able to integrate many image system functions into a single chip instead of multiple chips required to achieve the same functions by competitive image sensors. The highly integrated design enables customers to design cameras that are lower in cost, smaller, lighter in weight, consume less power, are more reliable and more easily integrated with other circuits than cameras using multiple-chip image sensors. OMNIVISION is based in Sunnyvale, California. For more information about the company, visit www.ovt.com.
OMNIVISION is a trademark of OMNIVISION Technologies, Inc. All other trade, product or service names referenced in this release may be trademarks or registered trademarks of their respective holders.
Certain statements in this press release, including statements regarding the strengthening of the company’s position as a leader in producing imaging devices for the OEM market and the timing of volume production of the OmniStar Cam are forward-looking statements that are subject to risks and uncertainties. These risks and uncertainties, which could cause the forward-looking statements and the company’s results to differ materially, include, without limitation: any delay in the timely production, acceptance and demand of the OmniStar Cam could adversely affect the company’s revenues and position as a leader in producing imaging devices and also could delay volume production of the OmniStar Cam; the complex and costly development process for products using CMOS image sensors could delay volume production of the OmniStar Cam; the company’s reliance on third parties to manufacturer its wafers, process its color filtering and assemble its products reduces the company’s control over the production process; failure to obtain acceptable wafer manufacturing yields could increase costs and may make the company’s products undeliverable and the other risks detailed from time to time in the company’s Securities and Exchange Commission filings and reports, including, but not limited to, the company’s quarterly reports filed on January 31, 2001. The company disclaims any obligation to update information contained in any forward-looking statement.