CameraCubeChip™

Technology Features

CameraCubeChip™ incorporates advanced image-sensor technology into a wafer-level chip-scale package.

CMOS Image Sensors

The CameraCubeChip™ leverages both OmniVision’s frontside–illuminated and backside-illuminated CMOS image-sensor technology.
Wafer-Level Optics

CameraCubeChip™ applies semiconductor stacking methodology to fabricate wafer-level optical elements as wafer structure layers.
Chip-Scale Packaging

OmniVision’s wafer-level chip-scale packaging expertise provides a simplified supply chain with standard surface mount handling.

Technology Benefits

Fully integrated components enable ultra-thin, compact devices with advanced imaging capability.

Small-Form-Factor Camera Solution

With the CameraCubeChip™, OmniVision delivers fully integrated CMOS-based chip products with high-quality camera functionality in very small footprints and low profiles to deliver miniature camera modules that fit in tiny spaces, allowing for multiple cameras in one device.

A Simplified Supply-Chain Solution

OmniVision has created a simplified, one-stop shop for wafer-level camera modules that require minimal assembly and handling. The reflowable CameraCubeChip™ can be directly soldered to the printed circuit board with no socket or insertion required, making integration simple.

Applications

The CameraCubeChip™ delivers miniature-camera solutions to the medical, AR/VR and mobile markets.

OmniVision’s CameraCubeChip™ integrates image sensors, processor and lenses in a miniature wafer-level camera module