CameraCubeChip®
OMNIVISION’s CameraCubeChip® Integrates Image Sensors, Processor and Lenses in a Miniature Wafer-Level Camera Module
Technology Benefits
Fully integrated components enable ultra-thin, compact devices with advanced imaging capability.
Small-Form-Factor Camera Solution
With the CameraCubeChip®, OMNIVISION delivers fully integrated CMOS-based chip products with high-quality camera functionality in very small footprints and low profiles to deliver miniature camera modules that fit in tiny spaces, allowing for multiple cameras in one device.
A Simplified Supply-Chain Solution
OMNIVISION has created a simplified, one-stop shop for wafer-level camera modules that require minimal assembly and handling. The reflowable CameraCubeChip® can be directly soldered to the printed circuit board with no socket or insertion required, making integration simple.
Technology Features
CameraCubeChip® incorporates advanced image-sensor technology into a wafer-level chip-scale package.
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CMOS Image SensorsThe CameraCubeChip® leverages both OMNIVISION’s frontside–illuminated and backside-illuminated CMOS image sensor technology.
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Wafer-Level OpticsCameraCubeChip® applies semiconductor stacking methodology to fabricate wafer-level optical elements as wafer structure layers.
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Chip-Scale PackagingOMNIVISION’s wafer-level chip-scale packaging expertise provides a simplified supply chain with standard surface mount handling.
Applications
The CameraCubeChip® delivers miniature-camera solutions to the medical, AR/VR and mobile markets.
Product Solutions
OMNIVISION places its customers at the leading edge of imaging technology with its commitment to innovative, forward-thinking solutions.
