3.45-micron BSI Global Shutter CMOS Image Sensor for Machine Vision Applications

The OG03A global shutter (GS) CMOS image sensor features a 3.45‑micron (µm) back-side illuminated (BSI) pixel for high sensitivity, industry-leading shutter efficiency and excellent low-light performance for applications including factory automation (FA), robotics, logistics, industrial barcode scanners and intelligent transportation systems (ITS). The advanced performance in a smaller pixel enables it to replace larger 4.8 µm pixel front-side illuminated (FSI) sensors traditionally used in machine vision products.

The OG03A10 (color) and OG03A1B (monochrome) are 3‑megapixel BSI GS sensors that feature OMNIVISION’s industry-leading technologies, including Nyxel® near-infrared (NIR) and PureCel®Plus‑S pixel architecture.

The OG03A comes in a 1/1.8‑inch optical format (OF) and supports 150 frames per second (fps) with 106 dB shutter efficiency. 20Ke- full-well capacity (FWC) increases high dynamic range (HDR) with low noise level, resulting in clearer pictures. On‑chip dual conversion gain (DCG™) HDR extends dynamic range, reproducing motion artifact-free and low-noise images in challenging lighting conditions.

The GS sensor fits the standard C‑mount lens and supports both LVDS and MIPI interfaces.

October 3, 2024: OMNIVISION Expands Machine Vision BSI Global Shutter Sensor Portfolio with Three New 3.45‑micron Pixel Products