The OmniPixel3 architecture uses leading-edge design rules in conjunction with a dedicated and proprietary 0.11-micron CMOS process. It incorporates several significant technology developments that enable increased pixel density and maximize the performance of the new 1.75-micron pixel:

• By optimizing the photodiode process and pixel design for high full-well capacity and installing a new low-noise pixel and column sense readout, OmniPixel3 avoids color distortion and offers improved dynamic range of up to 65dB.

• With up to 20 percent improvement in fill factor plus increased sensitivity, OmniPixel3 delivers more vibrant and truer-to-life color reproduction.

• A new color filter array technology and zero-gap micro-lens technology means excellent sensitivity and superior cross-talk performance.

• Additional process technology optimizations achieve ultra low dark current (30 e/sec) and low defect density, making OmniPixel3 technology ideal for use in low-light and variable light conditions.

• Further innovations include a new transfer gate design process and contact technologies that achieve lag-free operation throughout the signal range. Eliminating read-out lag ensures that no 'ghost images' or unwanted noise are present in the imaging process.