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OmniVision is the Leading Supplier of CMOS Image Sensors for Mobile Applications

OmniVision is the world's leading provider of CMOS image sensors to the mobile phone market, with well over a billion sensors shipped. Pioneering digital imaging technology for almost two decades, OmniVision has a solid track record of supplying the world's leading handset manufacturers with innovative, high-performance and cost-effective mobile imaging solutions. The company's understanding of the fast evolving mobile phone market, combined with its world-class products and expertise, enables its customers to stay at the forefront of mobile imaging trends.

Continuously ranking among the world's top three suppliers of image sensors to the mobile phone market, OmniVision has now taken a leading position by adding advanced 1.75 µm and 1.4 µm pixel architectures (OmniPixel3-HS™ and OmniBSI™, respectively) to its technology portfolio. These technologies keep OmniVision ahead of the curve, making it among the very first to offer 1/4-inch 5-megapixel and 1/3-inch 8-megapixel sensors. 

Leading OmniVision Mobile Technologies

OmniVision's technical leadership has always been the main driver behind its strong market position. OmniVision continues to invest in advancing its CMOS image sensor technology as well as other critical components in the image pipeline. Currently, OmniVision offers a wide range of technologies suitable for the mobile phone market.

Its high-sensitivity OmniPixel3-HS technology is notable for producing superior low-light sensitivity ranging from 960 up to 12,000 mV/lux-sec.

OmniVision's proprietary OmniBSI technology is its most recent offering into the mobile phone arena. This backside illumination pixel architecture allows OmniVision to further shrink pixels without sacrificing performance. OmniBSI has demonstrated a 50 percent increase in sensitivity and quantum efficiency relative to front-side illumination technologies, while also reducing crosstalk to achieve sharper images and better color reproduction. OmniBSI currently is offered in a 1.75 and 1.4 µm pixel and the company is already working on even smaller pixel generations, allowing handset makers to continue offering higher resolutions and more compact designs. But OmniBSI not only increases the performance, it also has a lower stack height, which means it can achieve a higher chief ray angle (CRA) to allow for lower height lenses and thinner camera modules, and due to higher tolerance to CRA changes, easier zoom implementation, all of which enable simpler and more robust mobile phone designs.

Beyond pixel architectures, OmniVision also offers a wide range of advanced image signal processing (ISP) capabilities embedded on its SoC sensors. The high-end SoCs use OmniVision's proprietary TrueFocus™ technology, which significantly improves camera performance, image quality, color reproduction and extended depth of field (EDoF). The embedded ISP also offers manufacturers a lower-cost alternative for high-end image sensors compared to a standard two-chip solution using an external ISP.

OmniVision Offers the Industry's Widest Product Portfolio

As the mobile camera phone market has grown to over one billion units a year, it has also become widely segmented, ranging from high-end camera phones, which are more like a camera with a phone, to phones offering extremely low resolution cameras. To be a complete supplier, OmniVision offers a wide portfolio of sensors dedicated for mobile phones that spans from CIF to 14-megapixels in a variety of optical formats from 1/13" to 1/2.3".

Available Now
OmniBSI™ 1.75 µm and 1.4 µm family

OV14810 - 14.6-megapixel RAW sensor for DSC and very high-end mobile phones

OV8810 - 8-megapixel RAW sensor for high-performance mobile phone and DSC

OV5650 - 5-megapixel RAW sensor for high-performance mobile phones and DSC

OV5642 - 5-megapixel RAW sensor for mass market mobile phones

OV2665 - 2-megapixel SoC sensor for mass market mobile phones

OmniVison Delivers a Wide Range of Package Options

The majority of OmniVision's sensors are offered as COB/RW (bare die options) or in CSP packaging, pioneered by OmniVision to simplify module manufacturing and improve blemish from particles on the sensor pixel array. CSP is now a well-established packaging technology in the CMOS image sensor market, is the same size as a bare die and is a surface mount device, so that the sensor can be soldered directly onto a printed circuit board.

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  • Mobile Phones
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  • Security & Surveillance
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  • Vertically Integrated Supply Chain
    OmniVision customers benefit from a simplified supply chain, which translates into faster time-to-market and improved cost efficiencies. VisEra, a joint venture with fab partner TSMC, packages the sensors while testing is completed at OmniVision Semiconductor (OSC) and the devices are then shipped directly to the customer. There are several key advantages to this simplified supply chain:
  • Time to Market - By having visibility into all aspects of the process, inefficiencies and contingencies are limited, thus reducing overall product development time.
  • Cost - Cost reduction is achieved through a reduction in the number of suppliers.
  • Performance - Developing the lens-in-lock step with the sensor delivers products that provide the right performance versus cost tradeoff for key customers and markets.